Advanced Thermal Solutions BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.


  • Fabricated from extruded aluminum
  • Low profile spread fin array
  • maxiGRIP™ heat sink attachment
  • High performance, phase change thermal interface material


  • Flip-chip processors
  • Linux board support packages (BSPs)
  • Integrated communications processors
  • Host and integrated host processors
Publicado: 2013-03-18 | Atualizado: 2020-12-15