Advanced Thermal Solutions BGA High-Performance Heat Sinks for NXP
Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.
Features
- Fabricated from extruded aluminum
- Low profile spread fin array
- maxiGRIP™ heat sink attachment
- High performance, phase change thermal interface material
Applications
- Flip-chip processors
- Linux board support packages (BSPs)
- Integrated communications processors
- Host and integrated host processors
Publicado: 2013-03-18
| Atualizado: 2020-12-15