Amphenol Industrial RADSOK® Power to Board Connectors bring more power with three high amperage products: PowerBlok™, RADSERT™, and PGY™. This RADSOK solution offers many options for high-current, single-point connections to printed circuit boards. The hyperbolic grid contact provides more surface area with many points of contact for heat dissipation at the pin and socket interface. This lowers temperature rise and reduces potential failures. The compact footprint design supplies up to 200A to the board, which preserves surface area and offers flexibility in board design. Amphenol Industrial RADSOK® Power to Board Connectors are designed to be applied manually via press-fit or reflow solder process, eliminating the need for additional wires and/or special crimp tools.