The Analog Devices board is attached to a heatsink using an electrically and thermally conductive epoxy. The design allows the board to provide a low thermal and low DC resistance path. Components are mounted on the board using an SN63 solder method. This allows designers to rework the surface-mount components without compromising the circuit board to heatsink attachment. The evaluation board and its components operate over the −40°C to +85°C ambient temperature range. During operation, designers can attach the evaluation board to a temperature-controlled plate to control the temperature of the HMC8500 during operation.