200-LPAM Conectores placa placa e Mezzanine

Resultados: 113
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Qtde RoHS Modelo ECAD Produto
Número de posições
Afastamento
Número de linhas
Estilo de acabamento
Ângulo de montagem
Altura da Pilha
Potência nominal
Regime de tensão
Taxa de dados máxima
Temperatura operacional mínima
Temperatura operacional máxima
Galvanização do contato
Material de contato
Material da caixa
Série
Embalagem
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
178Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
272Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
203Em estoque
Mín.: 1
Mult.: 1
Bobina: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
215Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
460Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec LPAM-30-01.0-S-06-1-K-TR
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
275Em estoque
Mín.: 1
Mult.: 1
Bobina: 325
Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
1 268Em estoque
Mín.: 1
Mult.: 1
Bobina: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
153Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
262Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
162Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
175Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
391Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
99Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
360Em estoque
Mín.: 1
Mult.: 1
Bobina: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
46Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
227Em estoque
Mín.: 1
Mult.: 1
Bobina: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
322Em estoque
Mín.: 1
Mult.: 1
Bobina: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
307Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
289Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
6Em estoque
Mín.: 1
Mult.: 1
Bobina: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
33Em estoque
300Esperado 02/03/2026
Mín.: 1
Mult.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
74Em estoque
Mín.: 1
Mult.: 1
Bobina: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
78Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
Tempo de conclusão sem o estoque 3 semanas
Mín.: 450
Mult.: 450
Bobina: 450

LPAM Reel
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
Tempo de conclusão sem o estoque 10 semanas
Mín.: 450
Mult.: 450
Bobina: 450

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel