congatec COM-HPC® Computer-on-Module
congatec COM-HPC® Computer-on-Module is used for high-performance computing that supports fast I/O like PCIe Gen5, and USB4 25G Ethernet. More I/O interfaces include 64x PCIe and 8x 25G Ethernet. The COM-HPC features more DRAM, with up to 1TB (8x full-size DIMM) and server CPU performance up to 300W power consumption for a Server-On-Module. The COM-HPC standard is hosted by the PCI Industrial Computer Manufacturing Group (PICMG) and is supported by up to now 29 companies.
Features
- COM-HPC modules are available from many different vendors, all exchangeable within the same pin-out and footprint
- COM-HPC modules come as COM-HPC mini, COM-HPC Client, and COM-HPC Server modules
- COM-HPC modules can host any computing core from x86 multicore processors and Arm® SoCs to graphics processing units, as well as
- ASICs and FPGAs
- Support of more and higher bandwidth I/Os including PCIe up to Gen 5 and beyond, USB4 / Thunderbolt 4, and up to 8 x 25GbE
- Higher performance thanks to power budgets of up to 107 watts on credit card-sized modules, 251W for COM-HPC clients, and 358W for server designs
- Increased availability and reliable multi-source strategy to improve production scalability and resilience against supply chain issues
- From SFF applications to full-blown server designs, developers can leverage the same design principles for different applications or complete product families, reducing NRE and increasing design security
- Identical design approach for all different computing designs accelerates and simplifies application design and improves time to market
- Reliable upgrade paths across processor generations increase application life cycle and ROI (Return On Investment)
- Future-oriented interface technology for an extra-long application life cycle without bottlenecks in data transfer rates
- Increased power budgets provide more headroom for designers to leverage the most powerful CPUs, I/Os, and memory, which all require more power for more performance
Overview
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Additional Resources
Published: 2021-03-04
| Updated: 2024-02-02