Microchip Technology DC-DC Power Modules

Microchip Technology DC-DC Power Modules allow fast time-to-market with powerful discrete solutions. These devices allow developers to use less board space, keep EMI low, and have their applications completed in a timely manner. With an integrated inductor and built-in power MOSFETs, these devices create an all-in-one, tested, and reliable package. Microchip Technology's power modules are your ideal choice for any design challenge.

Microchip Technology Power Modules include a controller, power switches, and the necessary passive components, all of which are fully tested and pre-characterized for EMI and DC performance, to offer a complete switching power supply solution. Available in an ultra-compact, rugged, and thermally enhanced package to improve high power density in your designs, these modules simplify your power design process while offering exceptional performance. Utilizing a proprietary Hyper Speed Control® architecture, these devices are designed to offer fast load transients to minimize output capacitance. Their HyperLight Load® mode provides efficiency improvements for light-load operation. Microchip also offers a power module that can be used to optimize the performance of FPGA-based designs.

Features

Low-Voltage Modules (VBR <70V)
- Ease of Use
  - Turnkey solution speeds time to market
  - Integrated controller, inductor, and MOSFETs for simplified design
  - Optimized pinout for easy layout and assembly
- Exceptional Performance
  - Up to 93% power conversion efficiency
  - Low radiated emissions (EMI)
  - Hyper Speed Control architecture fast load transient response
- Small Form Factor
  - Small QFN package reduces solution size
  - Uses up to 60% less board space versus discrete designs
  - Low height profile down to 0.9mm)
- Robust
  - Rugged package design for thermal performance, vibration, and humidity resistance
  - Fewer external components improve reliability

Medium- and High-Voltage Modules (VBR >100V)
- Ease of Use
  - Wide selection of voltage and current ratings, circuit topologies, and packages
  - Reduced assembly time
  - Customization of standard modules available
- Exceptional Performance
  - High power density
  - Isolated and highly thermally conductive substrate
  - Minimum parasitics
- Package Capability
  - Standard and custom packages
  - Standard and custom terminals
  - Various substrate technologies
- Reliability
  - Coefficient of thermal expansion matching
  - Packaging ensures environmental protection and mechanical robustness