Waffle Passive Components

Signal Conditioning The MPD-0222FCSP2 is a small footprint MMIC 2-22 GHz 2-Way power divider/power splitter featuring high 24 dB isolation and low 0.6 dB insertion loss in our compact CSP2 chip scale package.

Signal Conditioning The MPD-0422SCSP2 is a small footprint MMIC 4-22 GHz 2-Way power divider/power splitter featuring high 22 dB isolation and low 0.9 dB insertion loss in our compact CSP2 chip scale package.

Signal Conditioning The MBAL-0220CSP2 is a GaAs passive MMIC balun featuring a frequency range of 2 to 20 GHz. This balun offers low 1.9 dB insertion loss as a mode converter, excellent balance and 27 dB common mode rejection in a compact 2.5 mm CSP2 chip scale package.

Speciality Ceramic Capacitors 100Volts 820pF 20% S ingle Layer Cap

Signal Conditioning The MPD4-0108CSP2 is a small footprint MMIC 1-8 GHz 4-Way power divider/power splitter featuring high 30 dB isolation and low 2.6 dB insertion loss in our compact CSP2 chip scale package.

Signal Conditioning MPD-0226SM is a MMIC 2-way Wilkinson power divider. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. The MPD-0226SM is available as a 4 X 4 mm QFN package.

Thick Film Resistors - SMD CHP 2512 200PPM 120U 5% N TR e2

Speciality Ceramic Capacitors 50Volts10nF 20% Single Layer Cap

Multilayer Ceramic Capacitors MLCC - Leaded 2000VDC 0.018uF C0G 10% LS=6.35mm

Signal Conditioning X-Band100WLimiter,QFN

Resistor Networks & Arrays 2K/10K .1%ABS .05% RATIO

High Frequency/RF Resistors 2010 Ag over Ni 50Ohms 2%