High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2 051
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 Fabricante
Descrição Ficha técnica Disponibilidade Preços (EUR) Filtrar os resultados na tabela por preço unitário baseado na sua quantidade.
Qtde RoHS Modelo ECAD Produto
Número de posições
Afastamento
Número de linhas
Estilo de acabamento
Ângulo de montagem
Altura da Pilha
Potência nominal
Regime de tensão
Taxa de dados máxima
Temperatura operacional mínima
Temperatura operacional máxima
Galvanização do contato
Material de contato
Material da caixa
Série
Embalagem
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
2 973Em estoque
Mín.: 1
Mult.: 1
Bobina: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
339Em estoque
Mín.: 1
Mult.: 1
Bobina: 50

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
400Em estoque
Mín.: 1
Mult.: 1
Bobina: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
1 206Em estoque
Mín.: 1
Mult.: 1
Bobina: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
1 436Em estoque
Mín.: 1
Mult.: 1
Bobina: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
582Em estoque
Mín.: 1
Mult.: 1
Bobina: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
178Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
150Em estoque
Mín.: 1
Mult.: 1
Bobina: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
279Em estoque
Mín.: 1
Mult.: 1
Bobina: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
165Em estoque
Mín.: 1
Mult.: 1
Bobina: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
343Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
41Em estoque
Mín.: 1
Mult.: 1
Bobina: 50

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM-RA Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
225Em estoque
Mín.: 1
Mult.: 1
Bobina: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
189Em estoque
Mín.: 1
Mult.: 1
Bobina: 175

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
66Em estoque
Mín.: 1
Mult.: 1
Bobina: 75

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
192Em estoque
Mín.: 1
Mult.: 1
Bobina: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
101Em estoque
Mín.: 1
Mult.: 1
Bobina: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
91Em estoque
Mín.: 1
Mult.: 1
Bobina: 125

Connectors 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Ficha técnica
387Em estoque
Mín.: 1
Mult.: 1
Bobina: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
426Em estoque
Mín.: 1
Mult.: 1
Bobina: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Ficha técnica
107Em estoque
Mín.: 1
Mult.: 1
Bobina: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
60Em estoque
Mín.: 1
Mult.: 1
Bobina: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
186Em estoque
Mín.: 1
Mult.: 1
Bobina: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
238Em estoque
Mín.: 1
Mult.: 1
Bobina: 225

Connectors 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa placa e Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Ficha técnica
166Em estoque
Mín.: 1
Mult.: 1
Bobina: 100

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape