RISC-V Núcleo Módulos multiprotocolo

Resultados: 22
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Qtde RoHS Modelo ECAD Série
Frequência
Potência de saída
Tipo de interface
Tensão de alimentação - Mín
Tensão de alimentação - Máx
Temperatura operacional mínima
Temperatura operacional máxima
Tipo de conector de antena
Dimensões
Protocolo - Bluetooth, BLE - 802.15.1
Protocolo - WiFi - 802.11
Protocolo - ANT, Thread, Zigbee - 802.15.4
Embalagem
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
5Em estoque
Mín.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
2Em estoque
Mín.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Espressif Systems Módulos multiprotocolo SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Ficha técnica
3 280Em estoque
Mín.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems Módulos multiprotocolo SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Ficha técnica
811Em estoque
1 950Esperado 24/08/2026
Mín.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 520Em estoque
6 500No pedido
Mín.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 1 623Em estoque
3 250Esperado 08/02/2027
Mín.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 1 025Em estoque
8 450No pedido
Mín.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Seeed Studio Módulos multiprotocolo Seeed Studio XIAO ESP32-C6(Tape & Reel)
Ficha técnica
34Em estoque
Mín.: 1
Mult.: 1

Seeed Studio Módulos multiprotocolo XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics
Ficha técnica
2 314Em estoque
Mín.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 4MB flash
Ficha técnica
500Em estoque
Mín.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 8MB flash
Ficha técnica
365Em estoque
Mín.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 4MB flash
Ficha técnica
317Em estoque
Mín.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 8MB flash
Ficha técnica
452Em estoque
Mín.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Seeed Studio Módulos multiprotocolo Seeed Studio XIAO ESP32C3
1 735Em estoque
2 580Esperado 15/07/2026
Mín.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
SparkFun Módulos multiprotocolo ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Ficha técnica
29Em estoque
Mín.: 1
Mult.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
SparkFun Módulos multiprotocolo ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Ficha técnica
6Em estoque
Mín.: 1
Mult.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Espressif Systems Módulos multiprotocolo ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6(802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules.
Ficha técnica
3 230Esperado 17/08/2026
Mín.: 1
Mult.: 1

2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
Ficha técnica
800Esperado 29/09/2026
Mín.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
Ficha técnica
800Esperado 29/09/2026
Mín.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
Tempo de conclusão sem o estoque 6 semanas
Mín.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Quectel Módulos multiprotocolo Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
Ficha técnica
Tempo de conclusão sem o estoque 8 semanas
Mín.: 500
Mult.: 500
: 500
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel Módulos multiprotocolo Tempo de conclusão sem o estoque 5 semanas
Mín.: 1
Mult.: 1
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax