Novo Cabos D-Sub
Amphenol Commercial D-Sub Cable Assemblies offer EMI/RFI shielding, a rugged design, and secure mating, making them ideal for environments where reliability and signal integrity are crucial. The series features a current rating of up to 3A and wire gauges of 28AWG, 26AWG, 24AWG, and 20AWG, enabling designers to make selections based on current load, flexibility, and space constraints. Amphenol Commercial D-Sub Cable Assemblies operate within a temperature range of -20°C to +80°C and support moderate power applications. These robust and versatile connectors are ideal for electronics, industrial, and commercial environments. Typical applications include data, communications, instrumentation, set-top boxes, and medical instruments.
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Amphenol D-Sub Cable AssembliesOffers EMI/RFI shielding, a rugged design, secure mating, up to 3A, and 28AWG to 20AWG wire gauges.06/01/2026
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Winchester Interconnect M83513 Micro-D ConnectorsFeature a mechanically robust and durable rectangular form factor and low contact resistance.15/09/2025 -
L-Com Heavy Duty Deluxe D-Sub Cable AssembliesUtilizes 20AWG conductors, enabling maximum current throughput and an extremely durable assembly.14/12/2024 -
L-Com Data Interconnect SolutionsConsists of D-sub adapters, D-sub cable assemblies, and D-sub connectors.12/12/2024 -
Amphenol Conectores SnapLockConsist of two connection cables and two connecting cables and are available in three lengths.26/11/2024 -
MicroStrain by HBK IMUs Robustas de Grau Tático 3DM-GV7Apresentam um gabinete de alumínio usinado com precisão e foram testados com classificação IP68.08/04/2024 -
TE Connectivity Conjuntos de cabos AMPLIMITE D-SubminiatureDesenvolvidos para a família de conectores AMPLIMITE D-Subminiature, amplamente utilizada em indústrias eletrônicas.08/03/2024 -
Cinch Connectivity Solutions Space Screened Micro-D Cable AssembliesConforms to M83513 requirements and suitable for military, defense, and satellite applications.01/02/2024 -
Cinch Connectivity Solutions Micro-D Jumper AssembliesDesigned for rugged, high-performance, and densely compacted interconnect applications.28/08/2023